**Job Details:**

**Job Description:**
We are part of the assembly and test technology development team based in Chandler, supporting advanced electronic packaging technology development. Our team directly supports quality and reliability failure analysis and also supports package material and assembly process development.
The candidate will be responsible for conducting failure analysis to identify electrical failures, as well as physical failure analysis to support root cause understanding of new package technologies. Require setting up, operating and maintaining laboratory instruments, conducting experiments, making observations and documenting results, and often developing conclusions.
Candidate should exhibit the following behavioral traits:
• Verbal and technical writing skills.
• Work well with a team, deliver under pressure, and well organized.

**Qualifications:**

You must possess the below minimum qualifications to be initially consider...