Summary You will serve as a RADIATION HARDENED MICROELECTRONICS ACQUISITION ENGINEER in the FIRE CONTROL & GUIDANCE BRANCH (SP23) of STRATEGIC SYSTEMS PROGRAMS. Responsibilities You will maintain process control, quality, throughput, and on-time delivery for Tier 2 suppliers manufacturing Circuit Card Assemblies (CCAs) and electrical sub-components. You will monitor production line health, yields, and supplier process capabilities using Lean Six Sigma and statistical process controls. You will define and execute procurement controls for strategic sub-components, with an emphasis on radiation-hardened electronic components. You will coordinate with design authorities to manage material obsolescence and execute life-of-type (LOT) buys or alternative sourcing strategies to safeguard the industrial base. You will establish, review, and verify testing protocols, technical specifications, and disposition plans for Lot Acceptance Testing (LAT). You will ensure that incoming microelectronics l...