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Job Description:
Development of device testing at wafer level, die level and module level
More specific duties include the following:
Definition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products.Development, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners.Design of test application PCBs, test sockets, probe cards.Handover of test s...