We are looking for an R&D Release Technology Process Engineer to join our Material Transfer team and play a key role in developing the next generation of heterogeneous integration processes.

What you will do

You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to achieve higher performance and functionality. Advanced bonding processes with extremely precise overlay accuracy and exceptional wafer distortion control are enabling entirely new integration schemes for future semiconductor devices. The transfer of thin functional layers, such as epitaxial ruthenium, III-V semiconductors, diamond from their original substrates to new target wafers further unlocks new integration and opportunities. These approaches require highly reliable release technologies that not only preserve the transferred material...