Education:

BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field

Work Experience:

• At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead frame packages)
• Prior exposure and work in a high-volume IC assembly production/factory is preferred

Preferred Skills:

• CAD software use (e.g. AutoCAD and Cadence APD)
• FEA modeling experience for thermal, mechanical and electrical package optimization
• Advanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assembly
• Experience in strip testable package development

RESPONSIBILITIES:

• Identify suitable Panel Level and WLCSP (PLP) p...