Support developing and sustaining electroplating processes (Cu TSV/Damascene/ RDL/Pillar, UBM, micro-bump) in both R&D and small volume manufacturing environments.
Support troubleshooting, root cause analysis for electroplating defects (e.g., voids, roughness, non-uniformity, adhesion issues).
Design and perform DOEs to define process windows, characterize new requirements, and evaluate plating chemistries, technologies.
Compile, analyse, and interpret test data to establish process specifications.
Generate comprehensive technical reports for both internal teams and customers.
Collaborate closely with senior engineers, process integrators, and cross-functional teams to align with technology roadmaps and process capability requirements.
Job Requirements
Bachelor's or higher degree in Materials Science, Chemical Engineering, Chemistry, or related fields.
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