Boschman Advanced Packaging Technology is a high‑tech, engineering‑driven company based in the Netherlands, specializing in advanced back‑end semiconductor packaging solutions. We offer a unique one‑stop‑shop concept, providing services from package development to industrialization, including Package Development Services, Assembly & Test Services, and Industrial Equipment. Our focus areas include Power Electronics (Automotive, Smart Grid, Industrial), MEMS, and Sensors, in line with the Global Energy Transformation and Electric Revolution.

• Responsibilities:

  • Organize and prepare technically sound proposals for customers, including sales materials, technical specifications, and quotations.
  • Translate customer requirements into technical and mechanical system solutions, advising on equipment configuration and application solutions.
  • Act as a ...