Position Overview
Job Summary:
Essential Duties and Responsibilities:
The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization
Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposers and substrates
Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up
Work with IC design team to define IC package requirements
Design package layout using standard CAD tools
Extract package parasitic and conduct PI/SI analysis
Documentation and release in appropriate archival system
Preferred Knowledge, Skills, And Abilities
Layout:
Allegro Package Designer Plus (APD+) tools for designing the package and generatin...