We are seeking two talented and motivated wafer fab process engineers with a focus on advanced semiconductor packaging to join our cutting-edge fabrication team. In this role, you’ll work on the forefront of 3D chip stacking and flip-chip hybridization, building integrated devices that form the heart of next-generation electronic systems.This is your opportunity to work hands-on with state-of-the-art hybridization equipment, contributing directly to breakthrough innovations in device performance and packaging efficiency.Location: Shoreview, MN Wage: $70,000 - $85,000/year, depending on experienceHours: 1st shift | Monday – Friday | 7:30 am – 3:30 pmBenefits of the semiconductor advanced packaging engineer:

Be part of a dynamic and innovative engineering team

Opportunity to grow into a technical leadership role

Work directly on advanced optical semiconductor technologies

Career development in a forward-thinking environment