DUTIES & RESPONSIBILITIES:

1.Design structural solutions for passive all-optical connectivity products (optical engine, silicon photonic interconnect module, OIO/CPO packaging), including optical device packaging selection, coupling structure design, thermal structure design, and custom fixture development, to guarantee optical alignment accuracy and long-term reliability after packaging.

2.Collaborate with upstream optical component and substrate (glass/PCB) design teams to define packaging specifications, and promote full-cycle implementation of packaging solutions from R&D prototype verification to NPI mass production.

3.Lead the development and optimization of structural requirements for COB, flip-chip and other passive optical packaging processes, identify and solve structural warpage, alignment offset, delamination failure and other issues in the packaging process, and cooperate with reliability testing and failure analysis (FMEA)....