Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA).
Perform die extraction for various package types and execute layer-by-layer polishing at the die level.
Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques.
Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions.
Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emergin...
Ready to Apply?
Join thousands of Americans building their careers