Responsible for sustaining & improving the Die Attach / Wire Bond Process
Overall knowledge on electronicsmanufacturing and must be able to collect and analyze data in orderto create engineering reports for New products and regularproduction.
Monitor and maintain Assembly yieldwithin KPI target.
Key involvement in improving the systemsto bring down scrap rate due to process excursions.
Initiate process improvements througheffective evaluations of test/yield data and manufacturing defectsand make adjustments to process equipment accordingly.
Program, troubleshoot and maintainmanufacturing process equipment as required to meet the requiredyield target.
Support engineering initiatives inevaluating: solders, epoxies, new equipment (installations) andrecommend solutions both tactically and strategically.
Develop Manufacturin...
Ready to Apply?
Join thousands of Americans building their careers