Micron Technology Inc. is seeking a Global Quality Package Reliability Engineer in Penang, Malaysia. In this role, you will be responsible for package quality and reliability, coordinating package qualification efforts for new products, and assessing risks associated with product release. The ideal candidate should have a minimum of a BS degree in Engineering and experience in Micro Electronic Packaging. Strong analytical and problem-solving skills are essential. This position requires good communication skills and the ability to work independently.
#J-18808-Ljbffr