Job Description

We are seeking a Process Engineer with a minimum of 2 years of hands‑on experience in semiconductor back‑end assembly processes , particularly die bonding and wire bonding . The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high‑quality manufacturing performance.

The role requires strong technical understanding of back‑end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Key Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to m...