Are you ready to drive cutting-edge wafer bonding technologies? Join our wafer-level packaging team and help pioneer innovative processes for bonding and debonding wafers, enabling the development of next-generation 3D and heterogeneous integration technologies.
Your future tasks include:
Development and optimization of wafer bonding processes for advanced packaging and heterogeneous integrationOperation and ownership of wafer bonding equipment (wafer bond cluster line as well as stand-alone wafer bonder)Process development for permanent and temporary wafer bonding techniques such as metallic, adhesive, anodic, glass frit, hydrophilic and surface activated bonding (SAB)Pre-bond surface preparation including lithography, plasma activation, and wafer cleaning processesIntegration of bonding processes into microfabrication flows in cleanroom environmentCharacterization of bonded interfaces using bond metrolo...