Job Description1. Advanced Package BGA substrate layout and PV (DRC; LVL; LVS) check
2. 2.5D IC (CoWoS_S; CoWoS_L; CoWoS_R; EMIB) RDL & Sbustrate routing and PV check.
3. Co-work with package Design engineer to achive PKG design requirement and goal.
4. New PKG layout methodology Study and development.
5. New layout & PV EDA tool evaluation

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Requirement1. Bachelor's degree or above with major in EE, ME, or related engineering fields.
2. Familiar with Cadence APD/SiP or Siemens XPD PKG layout tools and operating those tools smoothly.
3. Familiar with the design flow of package design and RDL/SBT layout
4. Familiar and well known with the structures of FCCSP/FCBGA/HBPOP/PKG Module.
5. Experienced on CoWoS structure and Interposer/RDL/SBT design is plus.
6. Experienced on Cadence APD skill language development is a plus.
7. Familiar with PKG PV (DRC, LVS) check flow and tools (Calibre, 3DStack) is a plus