The main responsibilities of the job post is to perform lab analysis to support IC package development, including package materials characterization and package physical failure analysis. The candidate is expected to perform the lab analysis independently with related work experience in semiconductor lab analysis with minimum education qualification of diploma in mechanical engineering, chemical process or engineering, physics or materials disciplines.

• Perform die / package materials & package characterization and physical failure analysis (PFA) to support IC package & technology development.
• Perform lab analysis such as Scanning Acoustic Microscope (SAM), X-ray, cross section, scanning electron microscope (SEM), focused-ion-beam (FIB) cross sectioning, etc. to support silicon technology and package development.
• Support lab materials/chemicals supply and administration activities and lab tools maintenance/calib...