Our client is a global semiconductor technology leader at the forefront of advanced memory solutions. With a strong culture of innovation, integrity, and sustainability, the organization invests heavily in next‑generation process development and empowers engineers. Engineers are trusted to own critical modules, interact directly with global stakeholders and vendors, and contribute meaningfully to next‑generation technology scaling. With a strong commitment to sustainability, integrity, and community engagement, the organization balances innovation with responsibility, creating a workplace where top technical talent can build enduring careers.

Drive development of advanced packaging technologies across multiple engineering levels.

• Wafer‑Level Engineering: Develop and optimize wafer‑level packaging processes (e.g., WLP, FO‑WLP, RDL). Drive process improvements in lithography, bumping, and wafer preparation. Enhance...