Job Details

As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end‑to‑end development of innovative substrate designs. Your expertise will directly impact the performance, cost, and manufacturability of our products, helping Intel maintain its leadership in the semiconductor industry. Working collaboratively with cross‑functional teams, you will have the opportunity to optimize silicon‑package‑board interfaces and contribute to groundbreaking advancements in technology.

Key Responsibilities Include But Not Be Limited To

• Drive the entire substrate design process, from design through tape‑out, with a focus on performance, manufacturability, and cost optimization.
• Implement the physical layout and routing of package designs using design tools and methodologies and meeting the design requirements.
• Conduct substrate fit and routing studies to evaluate design, performance, and cost tradeoffs.
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