This senior technical contributor role will design, develop and resolve issues on advanced packages for high performance power semiconductor products with high reliability, low cost and mass production robustness by collaborating with multiple departments (Design, Assembly, Test, Reliability Engineering, Quality, Sales and Marketing Team) and suppliers/OSAT’s around the world.

• Responsible for packaging design and technology development on advanced high power discrete, muti-chip, stacked and module packages.
• Responsible for defining package design rules, process flow and material set for new products including automotive power packages.
• Analyze stress, thermal capability and electrical performancewith in-depth knowledge of thermal-mechanical and electro-chemical interactions.
• Define BOM, assembly process development, assembly specification and qualification per standard requirements.
• Run process DOE’s to define optimum process ...