Your Role

Key responsibilities in your new role

• Sustain daily activity (e.g. Assembly / Test DDM, FAR, Yield, and etc.)
• Support GCM & Technical discussion.
• Support SON new product release and ramp.
• Drive WB yield improvement (CIP).

Your Profile

Qualifications and skills to help you succeed

• Bachelor's degree in Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Materials Science / Semiconductor Technology.
• Min 5 years related experience in FOL / Die Bond Process Engineering or in Semiconductor Assembly Manufacturing background.
• Knowledge of statistical data analysis, analytical and problem-solving skills.
• Ability to anticipate issues and challenges and resolving them quickly.
• Expert in process knowledge and skills in manufacturing process & some equipment knowledge.
• Systematic Problem-Solving methodology (e.g. 8D, DMAIC, Process Map...