In this role, you will be working on leading‑edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As a member of the Packaging Analysis team, you will perform mechanical design and structural analysis for emerging packaging technologies. You will identify key failure modes under product use conditions and run appropriate parametric design studies to influence product and package design upstream. You will be responsible for the package stack‑up analysis, defining mechanical and thermal aspects that influence package form factors, and driving socket/enabling mechanisms. You will utilize Finite Element Analysis (FEA) and Geometric Dimensioning and Tolerancing (GD&T) to propose solutions that finalize the design. Your work will result in advanced package designs that meet power dissipation, assembly, and reliability requirements, while delivering a system level solution for leading‑edge products in the ...