Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat‑No‑lead) packages for SPS (Smart Power Stage) products and its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining; improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback/issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change‑management with suppliers to sustain/improve capacity and cost.

Qualifications

• Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
• Experience in process engineering or package development of material/...