Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging.
Strong understanding on wafer processing such as Front side of metal/Backgrind Backmetal, Taiko Backgrinding, Glass carrier bonding&grinding, Patterned back metal, Embedded die in substrate
Package technologies qualification for consumer & industrial power as well as automotive power applications.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
Resolve all process integration issues by ensuring all window checks are done on critica...
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