A leading electronics manufacturer located in Ipoh, Malaysia is seeking a qualified individual for a process engineering role focused on Power QFN package assembly. The ideal candidate will possess a degree in Mechanical, Material, Physics, Chemistry or Applied Sciences, with experience in package development and a solid understanding of quality requirements for various packaging types. The position offers a hybrid work model, allowing team collaboration in the office from Tuesday to Thursday, while providing flexibility for remote work two days a week.
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