Reliability engineering, physics-of-failure study, and formal qualification of InP and SiP chips
KEY RESPONSIBILITIES:
Definition and implementation of optical component reliability qualification programmes.
Assessment of optoelectronic component ageing characteristics, extracting failure mode specific degradation model & quantifying risks.
Customer interfacing on reliability documentation and reliability work based on solid knowledge of physics-of-failures.
Problem solving, test and characterisation engineering, and statistical data analysis.
KEY RELATIONSHIPS:
Assessment of reliability risks and the rapid verification of product reliability to the satisfaction of both internal and external customers.
Close working collaboration with chip design, process engineering, test engineering, product engineering, quality engineering and other downstream internal and external...
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