**岗位职责：**
1. 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护；
2. 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良；
3. 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控；
4. 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升；
5. 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。

**Why TI?**

+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)
+ Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here (https://careers.ti.com/en/sites/CX/pages/benefits)

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