Work with Broadcom’s IC substrate subcontractors to manage and resolve issues related to packaging, manufacturing, yield, quality, and delivery of high-volume semiconductor devices.
Lead NPI activity, risk assessments, process improvement & development, and production engineering support of high-volume IC substrate manufacturing.
Collaborate with Broadcom internal cross‑functional engineering teams to resolve interactive issues and advance new packaging technology toward high-volume manufacturing maturity.
Conduct pre‑production engineering activities for new products, driving improvements in process, visual mechanical yields, and cycle time.
Develop and enforce site‑to‑site standardizations in Best Known Methods, and verify compliance with Broadcom requirements.
Drive capability enhancement and cost‑reduction projects.
Qualifications
Bachelor’s degree in engineering (Mechanical, Manu...
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