**About the job**
Are you a hands‑on student with an interest in advanced imaging tools and image analysis? Are you eager to gain experience in cutting-edge technology and work alongside some of the brightest minds in the industry? We are looking for a motivated student to join our failure analysis team through a summer internship in 2026, with a possible continuation in a master’s thesis project for the academic year 2026/2027.
At the FA lab, we work hands‑on with state-of-the-art analysis tools to identify and understand the root cause of damage and defects in our microchips, in close collaboration with design and test engineers. We have a fully equipped lab at Nordic’s headquarters in Trondheim. Watch this video on YouTube to get an insight into our daily work.
**About the Position**
Microchips soldered onto PCBs are reliability stressed using temperature cycling, shocks, bending, and vibration. After stress, physical cross-sectioning is used to study crack formation in ...