【Takasaki/Toyosu】Principle Package Engineer

Job Description

**1. Package Development & NPI Support**
- Support package development activities for new Power MOSFET products including:
TOLL / TOLG / TOLT
Bottom-side cooled (BSC)
Dual-side cooled (DSC)
Top-side cooled (TSC)
. Advanced lead frame and clip-bond packages
- Define package requirements and specifications for new product development.
- Support package qualification and AEC-Q101 compliance activities.
- Drive package-related activities during NPI and product transition.

**2. Thermal & Mechanical Engineering**
- Perform thermal analysis and package characterization.
- Conduct thermal resistance and thermal impedance measurements.
- Evaluate package reliability associated with:
Power cycling
Thermal cycling
Solder joint reliability
Mechanical stress
- Support package-level failure analysis and root cause investigation.

**3. Package Benchmarking ...