1. Package Development & NPI Support

  - Support package development activities for new Power MOSFET products including:

     TOLL / TOLG / TOLT

     Bottom-side cooled (BSC)

     Dual-side cooled (DSC)

     Top-side cooled (TSC)

   . Advanced lead frame and clip-bond packages

  - Define package requirements and specifications for new product development.

  - Support package qualification and AEC-Q101 compliance activities.

  - Drive package-related activities during NPI and product transition.



2. Thermal & Mechanical Engineering

  - Perform thermal analysis and package characterization.

  - Conduct thermal resistance and thermal impedance measurements.

  - Evaluate package reliability associated with:

 &...