Your mission

The future of AI computing is light, not electrons.  

Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.  

As our Team Lead Co-Packaged Optics (CPO), you are the architectural and leadership anchor of our next-generation semiconductor packaging. You will build, coach, and scale a brand-new CPO Packaging Team from the ground up, driving the transition from concept phase to high-volume production. This role is about establishing absolute technical ownership at the intersection of photonics and electronics, bridging the gap between internal cutting-edge chip design and external global OSAT manufacturing.  

Your Responsibilities 

• Leadership & Team