Job Description
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Be responsible for Die Prep equipment day to day line sustaining, PM and conversion.
- Able to hands on and provide systematic problem analysis.
- Ability to troubleshoot, analyze complex problems and 5 WHY analysis.
- Be available for overtime work as of when needed.
- Experience in PM and major down troubleshooting.
- Responsible to liaise with process engineering team for low yield triggering.
Qualifications
REQUIRED:
- Certificate / Diploma in Electrical & Electronic / Mechatronic or Equivalent.
- 1~3 years of equipment engineering experience in Wafer soft test equipment maintenance.
PREFERRED:
- Knowledge in Backgrind, wafer saw and Taping will be added advantage.
- Die Prep equipment maintenance and troubleshooting skill, wafer handling skill and involve in some improvement project.
SKILLS: