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Responsible for the setup, conversion, calibration, repair, preventive, and predictive maintenance of automated test handlers used for Wafer Level Dicing Saw, AOI, Mount, Tape and Reel manufacturing equipment. These include automated handlers’ sub-assemblies and related components or parts.
Acts as OIC in the absence of an Engineer or Engineering Supervisor on matters related to equipment downtime, repair, and maintenance in Wafer Level Packaging and Module operation.Train operators on basic machine set-up in Wafer Level packaging and Module assembly.Coach and mentor junior level Technicians on the basic repair and troubleshooting of WLP and Module assembly equipment.Repair and troubleshoot machines to avoid downtime hours and ensure continuous production operation of WLP and Module assembly.Communicate equipment problems on their area of responsi...