Onsemi in Lapu-Lapu, Philippines is seeking an Ultrasonic Wire Bond Process Engineer to optimize and sustain ultrasonic wire bonding processes. This position demands at least 3 years of experience in semiconductor manufacturing, with a focus on wire bonding. Responsibilities include managing bonding tools, leading process improvements, and supporting volume manufacturing. A Bachelor’s degree in Engineering is required, alongside excellent problem solving and communication skills. Join a dynamic team in a fast-paced manufacturing environment.
#J-18808-Ljbffr