Overview

The Wire Bond Process Engineer (Thermosonic) owns, characterizes, and sustains the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires broad semiconductor manufacturing experience across materials, tooling, and equipment for Au, Al, and Cu wires and diverse package families in a fast‑paced manufacturing environment.

Reporting Relationship

Reports directly to the FOL Process Engineering Team Lead.

Responsibilities

• Define, sustain, and optimize key wire bond parameters and tooling effectiveness.
• Manage the recipe management system, process/setup controls, process capability, and SPC health for wire pull and bond shear.
• Generate and maintain PFMEA, Control Plan, Work Instruction, One Point Lesson, and reaction plans (OCAP).
• Troubleshoot and drive corrective actions for critical wire bond losses such as deformed bonds, NS...